Wettability of Solder.
نویسندگان
چکیده
منابع مشابه
Electromigration in Solder Joints and Solder Lines
Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...
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For help in preparation of this article, thanks to Austin Boyd, Gabriela Leu and Romain Prioul, Boston; Ray Kennedy, Edmonton; Patrice Ligneul, Dhahran, Saudi Arabia; John McCullagh, Sugar Land, Texas, USA; Guillemette Picard, Clamart, France; Raghu Ramamoorthy, Abu Dhabi, UAE; and Alan Sibbit, Moscow. Thanks also to the participants of the May 2007 Schlumberger Wettability Workshop, Bahrain. E...
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microfabrication applications, it is widely used to transfer the designed patterns from an etching mask to the substrate. When the sample is immersed into the etching bath, the etchant only contacts and reacts with the substrate surfaces where are uncovered by the etching mask. The suitable materials for the mask can be polymers or other materials such as photoresist, SU-8,SiO2 andSi3N4, which ...
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The dependence of the wettability of graphene on the nature of the underlying substrate remains only partially understood. Here, we systematically investigate the role of liquid-substrate interactions on the wettability of graphene by varying the area fraction of suspended graphene from 0 to 95% by means of nanotextured substrates. We find that completely suspended graphene exhibits the highest...
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ژورنال
عنوان ژورنال: HYBRIDS
سال: 1992
ISSN: 1884-1171,0914-2568
DOI: 10.5104/jiep1985.8.2_21